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 2SJ399
Silicon P-Channel MOS FET
REJ03G0193-0200Z (Previous ADE-208-267 (Z) ) Rev.2.00 Apr.05.2004
Application
Low frequency power switching
Features
* * * * * Low on-resistance Small package Low drive current 4 V gate drive device can be driven from 5 V source Suitable for low signal load switch.
Outline
MPAK
3 1 2 D 1. Source 2. Gate 3. Drain
G
S
Note:
Marking is "ZF-"
Rev.2.00, Apr.05.2004, page 1 of 5
2SJ399
Absolute Maximum Ratings
(Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Note: PW 100 s, duty cycle 10% Symbol VDSS VGSS ID ID(pulse)Note IDR Pch Tch Tstg Ratings -30 20 -0.2 -0.4 -0.2 150 150 -55 to +150 Unit V V A A A mW C C
Electrical Characteristics
(Ta = 25C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Note: Pulse Test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(off) RDS(on) Ciss Coss Crss td(on) tr td(off) tf Min -30 20 -- -- -1.0 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 2.7 2.0 1.1 22.3 0.17 530 2170 7640 7690 Max -- -- 2 -1 -2.0 7.5 7.0 -- -- -- -- -- -- -- Unit V V A A V pF pF pF ns ns ns ns Test Conditions ID = -100 A, VGS = 0 IG = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = -30 V, VGS = 0 ID = -10 A, VDS = -5 V ID = -20 mA, VGS = -4 V ID = -10 mA, VGS = -10 V VDS = -10 V VGS = 0 f = 1 MHz ID = -0.1 A VGS = -10 V RL = 100 PW = 5 s
Rev.2.00, Apr.05.2004, page 2 of 5
2SJ399
Main Characteristics
Pch (mW)
Maximum Channel Dissipation Curve 200
-1
Maximum Safe Operation Area 1 ms
I D (A)
-0.3 -0.1
= s PW0 m 1
150
Channel Power Dissipation
Drain Current
C D
100
n tio ra pe O
-0.03 -0.01
50
Operation in this area is limited by R DS(on)
-0.003
Ta = 25 C 0 50 100 150 Ta (C) 200
-0.001 -0.1 -0.3 -1 -3 -10 -30 -100
Ambient Temperature
Drain to Source Voltage
V DS (V)
Typical Output Characteristics -2.0 Pulse Test -0.5
Typical Transfer Characteristics V DS = -10 V
I D (A)
-5 V
-1.2
ID Drain Current
(A)
-1.6
-0.4
-4.5 V
-0.3
Drain Current
-4 V
-0.8
-3.5 V
-3 V
-0.2
75 C 25 C
Ta = -25 C
-0.4
-0.1
-2.5 V VGS = -2 V
0
-2 -4 -6 Drain to Source Voltage
-8 -10 V DS (V)
0
-1 -2 -3 Gate to Source Voltage
-4 -5 V GS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage
-0.4
Drain to Source On State Resistance R DS(on) ( )
-0.5
Drain to Source Saturation Voltage V DS(on) (V)
Static Drain to Source on State Resistance vs. Drain Current 100 Ta = 25 C 50 Pulse Test 20 10 5 VGS = -4 V 2 1
-0.01 -0.02 -0.05 -0.1 -0.2 -0.5 -1
-0.3
-0.2 A
-0.2 -0.1 A -0.1 I D = -0.05 A
-10 V
0
-4 -8 -12 Gate to Source Voltage
-16 -20 V GS (V)
Drain Current
I D (A)
Rev.2.00, Apr.05.2004, page 3 of 5
2SJ399
Static Drain to Source on State Resistance vs. Temperature 5 I D = -0.2 A -0.05 A -0.1 A V GS = -4 V I D = -0.2 A 2 VGS = -10 V -0.1 A -0.05 A Forward Transfer Admittance vs. Drain Current
Forward Transfer Admittance |y fs | (S)
Static Drain to Source on State Resistance R DS(on) ( )
1 0.5 Ta = -25 C 0.2 0.1 25 C 75 C
4
3
0.05 0.02 0.01
-0.01 -0.02 -0.05 -0.1 -0.2 -0.5 -1
1 0 -40
V DS = -10 V Pulse Test
0 40 80 120 160 Case Temperature Tc (C) Typical Capacitance vs. Drain to Source Voltage
Drain Current I D (A)
Switching Characteristics
10000 5000
100 50
Capacitance C (pF)
tf t d(off) tr t d(on)
20 10 5 2 1 0.5 0.2 0.1 0 -10
Switching Time t (ns)
Coss
2000 1000 500
Ciss
Crss -20 -30
VGS = 0 f = 1 MHz -40 -50
200 100
VGS = -10 V PW = 5 s -0.2 -0.5 -1 -2 Drain Current I D (A) -5
-0.1
Drain to Source Voltage V DS (V) Reverse Drain Current vs. Source to Drain Voltage -0.5
Reverse Drain Current I DR (A)
Pulse Test -0.4 -10 V -0.3 V GS = 0 -0.2 -5 V
-0.1
0
-0.4
-0.8
-1.2
-1.6
-2.0
Source to Drain Voltage
V SD (V)
Rev.2.00, Apr.05.2004, page 4 of 5
2SJ399
Package Dimensions
As of January, 2003
Unit: mm
0.65
0.10 0.4 + 0.05 -
0.16 - 0.06
+ 0.10
1.5 0.15
+ 0.2 - 0.6
0 - 0.1
0.95
0.95
1.9 0.2 2.95 0.2
0.3
+ 0.2 1.1 - 0.1
0.65
2.8
Package Code JEDEC JEITA Mass (reference value)
MPAK(T) -- Conforms 0.011 g
Ordering Information
Part Name 2SJ399 Quantity 3000 pcs Shipping Container 178 mm Taping Reel (TL)
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.2.00, Apr.05.2004, page 5 of 5
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0


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